| 发明名称 |
PROCESS FOR THE BACK-SURFACE GRINDING OF WAFERS. |
| 摘要 |
THE PRESENT INVENTION RELATES TO A PROCESS FOR THE BACK-SURFACE GRINDING OF WAFERS USING FILMS WHICH HAVE A SUPPORT LAYER, WHICH IS KNOWN PER SE, AND AN ADHESION LAYER WHICH CAN BE POLYMERIZED IN STEPS , AND TO FILMS WHICH INCLUDE SUCH AN ADHESION LAYER WHICH CAN BE POLYMERIZED IN STEPS, AND TO THE USE THEREOF.
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| 申请公布号 |
MY138243(A) |
申请公布日期 |
2009.05.29 |
| 申请号 |
MYPI20021608 |
申请日期 |
2002.05.02 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
ROGALLI, MICHAEL;SCHNEEGANS, MANFRED |
| 分类号 |
C09J7/02;B24B7/22;B24B41/06;C09J11/06;C09J133/00;C09J163/00;C09J167/00;C09J171/00;C09J175/04;H01L;H01L21/00;H01L21/30;H01L21/302;H01L21/304;H01L21/461;H01L21/58;H01L21/68;H01L21/78 |
主分类号 |
C09J7/02 |
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