| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for forming an adhesive layer suitable for the end face treatment for preventing the falling of particulate matters from the end face of a circuit board by forming an adhesive layer on the circuit board end face in order to eliminate the cause of the flying of the particulate matters from the end face of a metal foil-applied laminated circuit board or a printed circuit board, which flying causes unevenness on the circuit board, wire breaking or short circuit of a wiring pattern, and the like. SOLUTION: The end face treatment for preventing falling or flying of particulate matters from the end face comprises forming an adhesive layer on the end face by transferring the adhesive layer of an adhesive agent having a supporting substrate, which adhesive agent is provided by forming an adhesive layer on a supporting substrate, wherein the resin composition for preventing powder falling of a circuit board uses, in the substrate layer, a composition comprising an elastomer containing a functional group, a thermosetting resin, a curing agent and a filler. COPYRIGHT: (C)2009,JPO&INPIT
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