| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer chamfering device which reduces machining distortion and improves machining surface roughness, to thereby protect a wafer from being damaged, and also to provide a wafer chamfering method. SOLUTION: The wafer chamfering device holds the wafer W on a rotary wafer table 34, and carries out grinding of a peripheral portion of the wafer W by a grindstone. The wafer chamfering device detects changes of a current value, a rotational speed value, and a vibration value by a sensor 3, a sensor 4, a sensor mounted on a circumference fine grinding motor 56, or a sensor mounted on a notch fine grinding motor 59, and calculates external diameters of a circumference fine grinding grindstone 55 and a notch fine grinding grindstone 58, based on a detected result. Alternatively by adjusting pressing forces of the circumference fine grinding grindstone 55 and the notch fine grinding grindstone 58, machining distortion is reduced, and the machining surface roughness is improved, to thereby protect the wafer W from being damaged. COPYRIGHT: (C)2009,JPO&INPIT
|
