Used fluid separation medium e.g. saw particle, recycling method for manufacturing wafer i.e. silicon wafer, involves separating fluid from saw particles via filtration e.g. cross-flow-filtration, by using track filter

摘要

The method involves separating fluid from saw particles via a filtration e.g. dead-end-filtration, cross-flow-filtration and centrifugal filtration, by using a track filter, where maximum pore size of the track filter is 5 micrometer. Fluid permeates containing smooth grinding particles from saw good material are used. 30 percentage of filter surface is constituted by a pore surface. The filtration is performed place under pressure. A velocity device is used during the cross-flow-filtration.