| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and device for forecasting and detecting a polishing end point, and a method and device for monitoring a real-time film thickness, that suppress Joule heat loss due to an eddy current to the minimum, precisely forecast and detect a polishing end point, precisely calculate a remaining film thickness to be removed, a polishing rate and the like on the spot, and precisely evaluate whether a prescribed conductive film is appropriately removed. <P>SOLUTION: In the forecasting and detecting method, an injector 36 in a high frequency inductor type sensor is arranged adjacently to a prescribed conductive film 28, a magnetic flux change induced in the prescribed conductive film 28 by a magnetic flux formed in the inductor 36 is monitored, and on the basis of a magnetic flux change when a film thickness in polishing becomes a film thickness corresponding to skin depth determined by using a material of the prescribed conductive film 28 as one factor, a magnetic flux change portion for forecasting the polishing end point is detected, the polishing end point is forecasted from the magnetic flux change portion, and further a polishing rate and a remaining film thickness to be removed are calculated on the spot. <P>COPYRIGHT: (C)2009,JPO&INPIT |
