发明名称 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.
申请公布号 US2009095518(A1) 申请公布日期 2009.04.16
申请号 US20080245025 申请日期 2008.10.03
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 MATSUSHITA YOSHITAKA;OSHIMA KAZUHIRO;HORIUCHI AKIO
分类号 H05K1/11;H05K3/00 主分类号 H05K1/11
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