发明名称 |
Semiconductor device and method for manufacturing a semiconductor device |
摘要 |
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.
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申请公布号 |
US2009096078(A1) |
申请公布日期 |
2009.04.16 |
申请号 |
US20070973759 |
申请日期 |
2007.10.10 |
申请人 |
VISHAY GENERAL SEMICONDUCTOR LLC |
发明人 |
CHOU TA-TE;TIAN YONG-QI;LI XIAN |
分类号 |
H01L23/02;H01L21/56 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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