| 摘要 |
A semiconductor memory device is described that includes memory banks having memory cells and are laid out as a matrix on a semiconductor chip body. The semiconductor memory device includes a first pad group having first pads that are arranged in a line between two adjoining memory banks and a second pad group having second pads that are also arranged in a line between the two adjoining memory banks parallel to the first pad group. At least one third pad group is also formed interposed between the first and second pad groups having at least one third pad allowing for a reduction in size of the semiconductor memory device.
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