| 发明名称 |
INTEGRATED CIRCUIT UNDERFILL PACKAGE SYSTEM |
| 摘要 |
An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.
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| 申请公布号 |
US2009096112(A1) |
申请公布日期 |
2009.04.16 |
| 申请号 |
US20080336141 |
申请日期 |
2008.12.16 |
| 申请人 |
JEON HYUNG JUN;JANG KI YOUN;YANG DAE-WOOK |
发明人 |
JEON HYUNG JUN;JANG KI YOUN;YANG DAE-WOOK |
| 分类号 |
H01L23/28 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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