<p>The present invention generally comprises an electrostatic chuck base, an electrostatic chuck assembly, and a puck for the electrostatic chuck assembly. Precisely etching a substrate within a plasma chamber may be a challenge because the plasma within the chamber may cause the temperature across the substrate to be non-uniform. A temperature gradient may exist across the substrate such that the edge of the substrate is at a different temperature compared to the center of the substrate. When the temperature of the substrate is not uniform, features may not be uniformly etched into the various layers of the structure disposed above the substrate. A dual zone electrostatic chuck assembly may compensate for temperature gradients across a substrate surface.</p>
申请公布号
WO2009049054(A1)
申请公布日期
2009.04.16
申请号
WO2008US79357
申请日期
2008.10.09
申请人
APPLIED MATERIALS, INC.;BUCHBERGER, DOUGLAS, A., JR.;BRILLHART, PAUL