CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

摘要

A circuit board and a method for manufacturing the same are provided to strengthen the coupling between a substrate and a wiring layer by forming an anchor pattern in a surface of the substrate. An anchor pattern(15) is formed in the surface of a substrate(16). A wiring layer is laminated on the substrate. The anchor pattern is a plurality of protrusions formed in the surface of the substrate. The substrate is a core substrate. The core substrate has the plated through hole. The plated through hole passes through the substrate and the wiring layer in the thickness direction. The substrate includes a conductive core unit(10). The core unit is made of the carbon fiber reinforced plastic. A pilot hole(18) is formed in the core unit. The plated through hole is passed through the pilot hole. The inner wall of the pilot hole is coated with a plating layer(19). The pilot hole is filled with the insulating material(20).