| 发明名称 |
MICROSTRIP TRANSMISSION LINE, IMPEDANCE MATCHING CIRCUIT AND SEMICONDUCTOR CIRCUIT |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce signal loss caused by resistance in wiring when high-frequency signals are transmitted in a microstrip transmission line. <P>SOLUTION: The microstrip transmission line 5 is provided with: a signal wiring layer 4 having a signal line 4A; and a ground wiring layer 2 having a ground pattern 2A. The ground pattern 2A is configured so that the wiring density in a region opposite the signal line 4A is higher than the wiring density of a region other than the region opposite the signal line 4A. <P>COPYRIGHT: (C)2009,JPO&INPIT |
| 申请公布号 |
JP2009081534(A) |
申请公布日期 |
2009.04.16 |
| 申请号 |
JP20070247483 |
申请日期 |
2007.09.25 |
| 申请人 |
FUJITSU LTD |
发明人 |
SUZUKI TOSHIHIDE |
| 分类号 |
H01P3/08;H01L21/82;H01L21/822;H01L27/04 |
主分类号 |
H01P3/08 |
| 代理机构 |
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