| 摘要 |
PROBLEM TO BE SOLVED: To enable a liquid adhesive material to be effectively used in manufacturing a wafer having a rear surface onto which a liquid adhesive material is applied, and to prevent a chip scattering when cutting the wafer into individual pieces. SOLUTION: First, the whole surface at the side of the rear surface 1b of the wafer 1 is removed for thinning the wafer to a prescribed thickness such that the thickness of the whole wafer region equals to the "thickness of device formation region 4 after recessed part formation process + thickness of adhesive material 8 applied to recessed part 4A". Subsequently, only the region at the rear side corresponding to the device formation region 4 is ground to form the recessed part 4A, and the adhesive material 8 is applied to the recessed part 4A to a desired thickness. Then, lines 2 intended for division are cut into a plurality of individual chips 3. The adhesive material 8 applied to the recessed part 4A is dammed up by an annular projected part 5A around the recessed part 4A, and is hardly discharged. Consequently, the amount of use of adhesive material 8 can be suppressed to a necessary minimum, and the adhesive material 8 is flush with the annular projected part 5A, thereby flattening the whole rear surface of the wafer 1. COPYRIGHT: (C)2009,JPO&INPIT
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