发明名称 HIGH-VOLTAGE DEVICE AND MANUFACTURING METHOD OF TOP LAYER IN HIGH-VOLTAGE DEVICE
摘要 A high-voltage device including a first conductive type substrate, a gate, a second conductive type well, a second conductive type source region, a second conductive type drain region, conductive layers, and a first conductive type top layer. The gate is disposed on the substrate, and the well is disposed in the substrate at one side of the gate. The source region is disposed in the substrate at the other side of the gate. The drain region is disposed in the well of the substrate. The conductive layers are disposed on the substrate between the gate and the drain region. The top layer is disposed in the well of the substrate, and the well is below the conductive layers. One portion of the top layer near the gate has a thickness greater than that of the other portion of the top layer away from the gate.
申请公布号 US2009096039(A1) 申请公布日期 2009.04.16
申请号 US20070870243 申请日期 2007.10.10
申请人 UNITED MICROELECTRONICS CORP. 发明人 HUANG CHIH-JEN;HSU SHIH-MING
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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