APPARATUS FOR ATTACHING ADHESION FILM FOR MANUFACTURING SEMICONDUCTOR PACKAGES

摘要

Disclosed is an apparatus for attaching an adhesive film for manufacturing a semiconductor package, which automatically perform a process of attaching an adhesive film, which is used for adhesion of a different subplate, on one surface of a lead frame attached on a subplate. The apparatus includes a horizontal movement block installed to be horizontally moved by a linear movement device; a head block, which performs elevation movement on the horizontal movement block in up and down directions; a suction plate installed at a lower part of the head block in such a manner that the suction plate can rotate about a hinge shaft at a predetermined angel in up and down directions, the suction plate having a lower surface including a plurality of vacuum holes for vacuously sucking an adhesive film, wherein the apparatus sucks an adhesive film from an adhesive film stacking part, on which adhesive films are stacked, moves to a work table where the attachment object to be attached to the adhesive film is seated, and attaches the adhesive film to the attachment object on the work table.