An electronic RF chip package (100) with integrated antenna includes a top cover section (102) having on its external surface an integrated antenna (110) with antenna elements resonating at different polarizations, a RF chip (120) mounted on an internal surface of the top cover section and functionally coupled to the antenna elements to provide the different polarizations and a bottom cover sect shaped to accommodate the RF chip. The RF functional coupling is provided through radiating coupling slots or vias formed in the cover section.
