IMPROVED CHEMICAL MECHANICAL POLISHING PAD AND METHODS OF MAKING AND USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a CMP polishing pad which is reproduced by the minimum conditioning of abrasion property and has a polishing surface to extend a pad service life.

SOLUTION: The polishing pad has a densified polishing layer and a shape memory matrix material 36 which allows deformation of the polishing layer to its original shape 30 or programmed one. The polishing layer indicates a thickness OT when the shape memory matrix material 36 has the original shape 30, and a densified thickness DT when it has the programmed one, wherein DT is less than 80% of OT. A shape memory matrix indicates a decrease of ≥70% in a storage elastic modulus when the temperature of the shape memory matrix material increases from (Tg-20°C) to (Tg+20°C), and the polishing layer has a polishing surface suitable for polishing substrates.

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