发明名称 HEAT-RADIATING BOARD FITTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a heat-radiating fitting structure capable of securely fixing a heat-radiating board to a device at a suitable position with a simple constitution. SOLUTION: The heat-radiating board fitting structure includes a shield case 3 containing a printed wiring board 1 mounted with the device 11, and a plate-like member 31 which supports the heat-radiating board 2 having fins 211 by cutting a portion of the shield case 3 and bending the cut portion toward the printed wiring board and also pressing a heat absorption surface 22 of the heat-radiating board 2 against the device 11. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009081157(A) 申请公布日期 2009.04.16
申请号 JP20070247107 申请日期 2007.09.25
申请人 FUNAI ELECTRIC CO LTD 发明人 NAKANO TAKAHIRO
分类号 H01L23/40;H01L23/36;H05K7/20;H05K9/00 主分类号 H01L23/40
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