发明名称 HEAT DISSIPATING COMPONENT, AND HEAT DISSIPATING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipating component and a heat dissipating structure capable of securing heat dissipation as well as preventing thermal deformation without adding any extra additional structure. SOLUTION: The heat dissipating component is located in the passage of a heating medium to exchange heat with the heating medium. The component includes a plate-like base part 1 and a wall-like fin 3 extending in the base part, and the extending shape of the wall-like fin has a length component in the direction perpendicular to the direction of the passage. The component is disposed so that the exit side is obstructed by the wall-like fin 3, when viewing the exit side along the passage direction of the base part from any location within at least the center range Wc of the width on the entrance side of the base part. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009081220(A) 申请公布日期 2009.04.16
申请号 JP20070248344 申请日期 2007.09.26
申请人 SUMITOMO ELECTRIC IND LTD 发明人 FUTAI KAZUHIKO
分类号 H01L23/473 主分类号 H01L23/473
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