| 摘要 |
An optical data transceiver is manufactured by forming an integrated control circuit (101) on a suitable substrate, such as a silicon wafer, and then mounting said integrated circuit (101) onto the lead frame (102). Electrical connections may then be made between said integrated circuit (101) and said lead frame (102). The combined assembly comprising the integrated circuit (101) and lead frame (102) is then inserted into the cavity of a mould tool (not shown). A suitable moulding compound is injected to encapsulate the combined assembly. The mould tool is provided with a projection (not shown) that is in contact with a portion of the surface of the integrated circuit (101) when the assembly is in the mould tool. As a result, the opening (106), exposing that portion of the surface of the integrated control circuit (101) that was in contact with the projection of the mould tool, is provided. The cavity of the mould tool is also adapted so as to form a rim (107) around the opening (106) during the encapsulation process. After the encapsulation process is complete, an optically active element (105) is then connected to the integrated circuit (101). |
