| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board allowing a high-definition pattern to be formed, formable by a simple process, and capable of preventing a problem such as liquid waste disposal from occurring. SOLUTION: In order to solve the above problem, the multilayer wiring board characterized by laminating two or more wiring boards each comprising: a characteristic change layer containing at least a photocatalyst and changing its characteristics by the action of the photocatalyst; and a conductive pattern formed along a pattern of the characteristic change layer with the characteristic changed. COPYRIGHT: (C)2009,JPO&INPIT |
