发明名称 |
METHOD OF FORMING PREMOLDED LEAD FRAME |
摘要 |
A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.
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申请公布号 |
US2009098686(A1) |
申请公布日期 |
2009.04.16 |
申请号 |
US20080126943 |
申请日期 |
2008.05.26 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
XU XUE-SONG;BAI ZHI-GANG;XU NAN;YAO JIN-ZHONG |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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