| 摘要 |
A method for manufacture of an electronic interface card (100) including defining a pair of apertures in a substrate layer (116), associating an antenna (112) with the substrate layer (116) such that opposite ends of the antenna (112) terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer (114) and a bottom layer (118), forming a recess (122) in the top layer and the substrate layer, attaching end of connection wires (130) to the metal elements, attaching opposite ends of the connection wires (130) to a chip module (120) and sealing the chip module in the recess (122). |
