发明名称 HEAT DISSIPATING STRUCTURE OF HEAT GENERATING COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipating structure of a heat generating component, which loweres the temperature by improving heat dissipation. SOLUTION: A TRIAC 2 which switches ON/OFF of power supply to an illumination load from an AC power supply by switching ON/OFF between both terminals is housed in the corner part of a body 10 with a heat dissipating plate 3 mounted. The heat dissipating plate 3 is formed by a material having high thermal conductivity, such as aluminum for example, and is composed of a contact part 30 making surface contact with the heat dissipating side (back) of the TRIAC 2, and tip parts 31, 31 extended by being bent from both end of the contact part 30 in the direction separating from the TRIAC 2. Each tip part 31 has an extended part 32 extended inward from its fringe part along the direction from its base end on the contact part 30 side to the tip. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009081207(A) 申请公布日期 2009.04.16
申请号 JP20070248118 申请日期 2007.09.25
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 KAKIUCHI KOJI;FUKUO HISANORI;SAKAI SADASHIGE
分类号 H01L23/34 主分类号 H01L23/34
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