| 摘要 |
PROBLEM TO BE SOLVED: To easily confirm a state of contact between terminals of an electronic component and terminals of a substrate of a mounting structure constituted by mounting the electronic component on the substrate by elastically deforming the terminals of the electronic component. SOLUTION: Disclosed is the mounting structure 1 having a semiconductor device 2 mounted on a mounting surface S1 of the translucent substrate 3 with an NCF 4 interposed therebetween. A plurality of terminals 21 and 22 are provided on the surface S1 of the substrate 3, the semiconductor device 2 has a plurality of bumps 12 and a pair of a first inspection bump 18 and a second inspection bump 19 on the surface of the substrate 3, and the inspection bumps 18 and 19 have contact surfaces 25 and 26 elastically deformed in contact with the surface S1 of the substrate 3 respectively, a contact surface 25 of the inspection bump 18 having long sides in a longitudinal or lateral direction and a contact surface 26 of the second inspection bump 19 having long side in a direction different from the long sides of the contact surface 25. Further, one of the contact surfaces 25 and 26 may have different longitudinal and lateral widths and the other may have equal longitudinal and lateral widths. COPYRIGHT: (C)2009,JPO&INPIT |
