| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can prevent insufficient drying even for a substrate having micro patterns. SOLUTION: A control section 67 supplies a pure water as a treatment liquid to a processing tank 1, and processes a substrate W at a processing position with the pure water, and then it reduces pressure within a chamber 27 by an evacuation pump 52 and supplies solvent vapor into the chamber 27 through a solvent nozzle 33. Thus, the pure water on the surface of the substrate W is replaced by a solvent, but the pure water in the depth of the micro pattern cannot be replaced. In case when the concentration of the solvent reaches a specified value in a state the substrate W is moved to a drying position, the pressure in the chamber 27 is reduced again by the evacuation pump 52. Thus, a lid-like object formed on the surface of the micro pattern is removed, the pure water penetrating the micro pattern is replaced by the solvent. Therefore, even a substrate W with micro patterns can be processed without insufficient drying. COPYRIGHT: (C)2009,JPO&INPIT
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