发明名称 TAPE-BONDING METHOD AND TAPE-APPLYING DEVICE
摘要 PROBLEM TO BE SOLVED: To accurately plaster an adhesive tape at a predetermined position so that adhesion and sealability are satisfactory. SOLUTION: The tape-applying device 10 has a first tape-bonding head 13a and a second tape-bonding head 13b both being forwardly movable. The first tape-bonding head 13a comprises a tape guide 24a and a roller 26a, and the second tape-applying head 13b comprises a tape guide 24b and a roller 26b. The adhesive tape 11 is adsorbed and held by guide grooves 21a and 21b mounted on the front surfaces of the tape guides 24a and 24b. The first and second tape-applying heads 13a and 13b are moved to let a vessel pass between the first and second tape-applying heads 13a and 13b. In this case, the first and second tape-applying heads 13a and 13b each slide in the lengthwise direction, push and plaster the tape to the vessel along the straight line perpendicular to the lengthwise direction with the rollers 26a and 26b. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009078835(A) 申请公布日期 2009.04.16
申请号 JP20070248964 申请日期 2007.09.26
申请人 FUJIFILM CORP 发明人 MIYASHITA TAKUYUKI
分类号 B65B51/06 主分类号 B65B51/06
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