发明名称 DIVIDING APPARATUS AND DIVIDING METHOD OF BRITTLE MATERIAL SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a dividing apparatus and a method for dividing a workpiece while keeping it in a nearly free supported state. SOLUTION: The dividing apparatus of the brittle material substrate with at least an initial crack formed therein, having the brittle material substrate placed on a processing table 1 so that the vicinity of a dividing scheduled line becomes a nearly free supported state, is constituted of a crack growing means and a crack growth suppressing means. A dividing control device 5 wherein the crack growth suppressing means is placed ahead of the crack growing means, is kept in a nearly non-contact state with the brittle material substrate, and is moved from the initial crack of the brittle material along the dividing scheduled line to divide the brittle material substrate linearly or curvedly. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009078502(A) 申请公布日期 2009.04.16
申请号 JP20070251006 申请日期 2007.09.27
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 MORITA HIDEKI
分类号 B28D5/00;C03B33/09 主分类号 B28D5/00
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