发明名称 DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET FOR WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
摘要 The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion of 5 to 100 parts by weight with respect to 100 parts by weight of a total solid in the pressure-sensitive adhesive composition except the electrically conductive filler. The double-sided pressure-sensitive adhesive tape or sheet is excellent in adhesiveness, electrically conducting property and anti-repulsion property, and thus can be advantageously used for wiring circuit board.
申请公布号 US2009095517(A1) 申请公布日期 2009.04.16
申请号 US20080249704 申请日期 2008.10.10
申请人 NITTO DENKO CORPORATION 发明人 NONAKA TAKAHIRO;DAIGAKU NORITSUGU;NAKAYAMA JUNICHI
分类号 H05K1/02;B32B19/04 主分类号 H05K1/02
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