发明名称 METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS WITH PORTIONED LIQUID ENCAPSULATING MATERIAL
摘要 <p>The invention relates to a method for encapsulating electronic components placed on a carrier, wherein non-portioned encapsulating material, which is first melted to form pellets before it is employed for the encapsulation, is fed to an encapsulating device. The invention also relates to a device for encapsulating electronic components in accordance with this method.</p>
申请公布号 WO2009048330(A1) 申请公布日期 2009.04.16
申请号 WO2008NL50643 申请日期 2008.10.09
申请人 FICO B.V.;VAN DRIEL, ALBERTUS FRANCISCUS GERARDUS;ZIJL, JOANNES LEONARDUS JURRIAN 发明人 VAN DRIEL, ALBERTUS FRANCISCUS GERARDUS;ZIJL, JOANNES LEONARDUS JURRIAN
分类号 B29C45/14;B29C31/06;B29C70/78 主分类号 B29C45/14
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