发明名称 |
METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS WITH PORTIONED LIQUID ENCAPSULATING MATERIAL |
摘要 |
<p>The invention relates to a method for encapsulating electronic components placed on a carrier, wherein non-portioned encapsulating material, which is first melted to form pellets before it is employed for the encapsulation, is fed to an encapsulating device. The invention also relates to a device for encapsulating electronic components in accordance with this method.</p> |
申请公布号 |
WO2009048330(A1) |
申请公布日期 |
2009.04.16 |
申请号 |
WO2008NL50643 |
申请日期 |
2008.10.09 |
申请人 |
FICO B.V.;VAN DRIEL, ALBERTUS FRANCISCUS GERARDUS;ZIJL, JOANNES LEONARDUS JURRIAN |
发明人 |
VAN DRIEL, ALBERTUS FRANCISCUS GERARDUS;ZIJL, JOANNES LEONARDUS JURRIAN |
分类号 |
B29C45/14;B29C31/06;B29C70/78 |
主分类号 |
B29C45/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|