| 摘要 |
<p>A core substrate and a method for manufacturing the same are provided to prevent expansion of a plating layer in an inner surface of a base hole by discharging the gas generated from a core unit and a substrate through a gas exhaust hole. A core substrate includes a core unit(10), a conductive layer, a gas exhaust hole, an insulating material, a wiring layer and an insulating layer. A pilot hole is formed in the core unit. The plated through hole is penetrated through the pilot hole. The core unit has the conductivity. The conductive layer is formed in the inner wall surface of the pilot hole and the surface of the core unit. The gas exhaust hole is formed in the conductive layer. The insulating material is filled between the inner wall surface and an outer circumference of the plated through hole. The wiring layer is laminated on both sides of the core unit. A copper foil(14) is adhered in both sides of the core unit. The insulating layer is formed in the conductive layer.</p> |
