| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus and its manufacturing method capable of improving a yield of the electronic apparatus by preventing damage to a semiconductor chip in a packaging work process including a sealing resin formation process. <P>SOLUTION: The electronic apparatus includes: a plurality of semiconductor apparatuses 12-1 to 12-3 judged as good items in electrical and functional inspections which has internal connection terminals 32 disposed on electrode pads 43 of semiconductor chips 31, a resin layer 33 which is disposed on the semiconductor chips 31 in which the electrode pads 43 are formed and exposes the internal connection terminals 32, and wiring patterns 35 which are disposed on the resin layer 33 and are connected to the internal connection terminals 32; a wiring substrate 11 on which the plurality of semiconductor apparatuses 12-1 to 12-3 are stepwise stacked while electrically connected to the plurality of semiconductor apparatuses 12-1 to 12-3; and a sealing resin 13 with which the plurality of semiconductor apparatuses 12-1 to 12-3 are sealed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
