发明名称 LATENT CURING TYPE EPOXY RESIN COMPOSITION OF PHOTO-HEAT COMBINATION TYPE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a photo-heat combination type composition which shows sufficient provisional curability by practicable light, and is effective in ensuring reliability necessary for an electronic material. <P>SOLUTION: The latent curing type epoxy resin composition comprises (A) 100 parts by weight of an epoxy resin, (B) 5 to 25 parts by weight of a photo-cationic polymerization initiator, and (C) 5 to 35 parts by weight of at least one heat-set anion curing agent selected from the group consisting of an epoxy adduct with an amine compound, a urea adduct with an amine compound, and a compound in which an isocyanate compound is added to a hydroxy group of an epoxy adduct with an amine compound. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009079216(A) 申请公布日期 2009.04.16
申请号 JP20080224258 申请日期 2008.09.02
申请人 NAMICS CORP 发明人 IWATANI KAZUKI
分类号 C08G59/40;C08G59/68;H01L21/52 主分类号 C08G59/40
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