发明名称 |
METHOD FOR PRODUCING A THIN SEMICONDUCTOR CHIP COMPRISING AN INTEGRATED CIRCUIT |
摘要 |
In a method for producing a thin film chip including an integrated circuit, a semi-conductor wafer having a first surface is provided. At least one cavity is produced under a defined section of the first surface by means of porous silicon. A circuit structure is produced in the defined section. The defined wafer section is subsequently released from the semiconductor wafer by severing local web-like connections, which hold the wafer section above the cavity and on the remaining semiconductor wafer.
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申请公布号 |
US2009096089(A1) |
申请公布日期 |
2009.04.16 |
申请号 |
US20080208514 |
申请日期 |
2008.09.11 |
申请人 |
BURGHARTZ JOACHIM N;ZIMMERMANN MARTIN;APPEL WOLFGANG |
发明人 |
BURGHARTZ JOACHIM N.;ZIMMERMANN MARTIN;APPEL WOLFGANG |
分类号 |
H01L23/52;H01L21/761 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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