发明名称 APPARATUS AND METHOD OF MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a mounting apparatus not allowing an anisotropic conductive material to be solved and cured before final compression bonding of TCP to a liquid crystal cell. SOLUTION: The TCP mounting apparatus finally compression-bonds TCP6, which has been tentatively compression-bonded with the anisotropic conductive material of thermosetting resin, to a side part of the liquid crystal cell 4. This TCP mounting apparatus includes a transfer table 47 for transfer by holding the liquid crystal cell at the upper surface and projecting the side part to which TCP is tentatively compression-bonded to the external side, a backup tool 19 for supporting the lower surface of the tentatively compression-bonded side par with TCP of the liquid crystal cell located for transfer with the transfer table that is provided to be driven in the vertical direction, and a pressurizing tool 16 for supporting, with its backup tool, the lower surface of the part that is driven in the falling direction synchronously with drive in the upward direction of the backup tool and is allowing tentative compression-bonding of TCP of the liquid crystal cell and also for finally compression-bonding TCP by giving pressure thereto. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009081311(A) 申请公布日期 2009.04.16
申请号 JP20070250246 申请日期 2007.09.26
申请人 SHIBAURA MECHATRONICS CORP 发明人 NAKAMURA KENTARO
分类号 H01L21/60 主分类号 H01L21/60
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