| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing device provided with a tape expansion means that can clearly recognize a space between devices stuck to a dicing tape. SOLUTION: The laser processing device includes: a tape expansion mechanism holding a wafer stuck to a surface of a dicing tape mounted to an annular frame, and expanding the dicing tape; and a laser beam irradiation means irradiating the wafer held to the tape expansion mechanism with a laser beam. The tape expansion mechanism includes: a chuck table holding a wafer sticking region on the dicing tape mounted to the annular frame; an annular frame holding means holding the annular frame; and a movement means relatively moving the annular frame holding means and the chuck table in the axial direction. The chuck table includes: a chuck table body; a holding member arranged on the upper surface of the chuck table body, provided with a holding surface holding the whole surface of the wafer, and comprising a transparent or translucent member; and a light emitter arranged on the side opposite to the holding surface of the holding member. COPYRIGHT: (C)2009,JPO&INPIT
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