发明名称 PARTIAL PLATING METHOD AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To plate only a required part of an article to be plated, with a simple process at a high speed. SOLUTION: This plating method includes: making a plating solution 40 adhere to a peripheral part of a rotary plate 3 to be rotationally driven, by bringing a part of the rotary plate 3 in contact with the plating solution 40; and electroplating the part 11, which is desired to be plated, of the article 1 to be plated, by bringing the plating solution 40 adhering to the perimeter of the rotary plate 3 in contact with the part 11 to be plated, when the peripheral part of the rotary plate 3 passes the vicinity of the part 11, which is desired to be plated, of the article 1 to be plated. The plating method can plate only the desired part to be plated by bringing the plating solution in contact with the part to be plated through the rotary plate. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009079243(A) 申请公布日期 2009.04.16
申请号 JP20070248127 申请日期 2007.09.25
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 MARUYAMA MASAHIDE
分类号 C25D5/02;C25D5/04;C25D7/00 主分类号 C25D5/02
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