| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device by which a warp of a case material is suppressed. <P>SOLUTION: The circuit device according to this invention is equipped with: a circuit substrate 18 in which a hybrid integrated circuit comprising conductive patterns 22 and circuit elements is included in a top face thereof; a case material 12 constituting a space sealing the circuit elements on a top face of the circuit substrate 18 by contacting to the circuit substrate 18, while providing four sidewall portions constituted in a frame shape; and a lead 14 which is fastened to a pad 13 comprising the conductive patterns 22 and outwardly extends therethrough. Further, there is provided a support 30A by which inner walls of the sidewall portions are made consecutive at corners of the case material 12. <P>COPYRIGHT: (C)2009,JPO&INPIT |
