| 摘要 |
<P>PROBLEM TO BE SOLVED: To make uniform mounting heights of electronic components to be arranged by eliminating the need of an adhesive. <P>SOLUTION: A multilayer board with a built-in electronic component has: a core 201 with a plurality of holes 202 capable of holding an electronic component 205 formed; a lower insulating resin layer 204 formed on the lower surface of the core; an upper insulating resin layer 206 formed on the upper surface of the core; a wiring layer that is selectively formed on the outer layer of the lower insulating resin layer or the upper insulating resin layer; and the electronic component stored in the holes. In the multilayer board with the built-in electronic component, the lower and upper insulating resin layers have a combined structure of resin changing in such a manner as to have viscosity by heating and having plastic deformation reduced by heating at a higher temperature and an insulating resin layer having plastic deformation that is small compared with the first one in a thickness of securing the insulation between a conductor of the electronic component or the core and the wiring layer. Thereby, the multilayer board with the built-in electronic component has the structure of bonding and fixing the electronic component into the hole without using a special adhesive to seal it. <P>COPYRIGHT: (C)2009,JPO&INPIT |
