| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sensor device capable of suppressing a deterioration in reliability while reducing a mounting area. SOLUTION: The silicon microphone (semiconductor sensor device) includes a sound collecting element part 20 made of silicon and a protective cover 30 for covering the top part of the sound collecting element part 20. The sound collecting element part 20 includes a semiconductor substrate 1 made of silicon, a vibration membrane 11 provided on the semiconductor substrate 1 so that it can be vibrated, a back electrode plate 12 arranged oppositely to the vibration membrane 11 with a prescribed interval, and an opening part 1a for sound collection which penetrates the semiconductor substrate 1 in the thickness direction of the semiconductor substrate 1. A plurality of through electrodes 40 penetrating from the top surface to the bottom surface in the thickness direction are formed on the semiconductor substrate 1. Thus, the silicon microphone is configured in a WLCSP (Wafer Level Chip Scale Package) type package form. COPYRIGHT: (C)2009,JPO&INPIT
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