发明名称 |
METHOD FOR WAFER TEST AND PROBE CARD FOR THE SAME |
摘要 |
<p>A method of testing a wafer capable of minimizing the asymmetrical thermal deformation of a probe card when a wafer is tested using a probe card and of minimizing the number of times of tests to effectively test a large area wafer and a probe card for the same is presented. For the wafer test method for testing semiconductor chips on a wafer using a probe card, the method includes creating virtual repeating units corresponding to N semiconductor chips, wherein the N is natural number larger than or equal to 2, arranging the plurality of repeating units on the wafer and moving the probe card or the wafer N times and testing the semiconductor chips on a wafer, wherein the semiconductor chips in the repeating units are sequentially tested one by one per each touchdown. Also, the probe cards to realize above mentioned method have been described.</p> |
申请公布号 |
WO2009048255(A2) |
申请公布日期 |
2009.04.16 |
申请号 |
WO2008KR05900 |
申请日期 |
2008.10.08 |
申请人 |
AMST CO., LTD.;CHUNG, IN BUHM;SONG, BYUNG CHANG;KIM, DONG IL |
发明人 |
CHUNG, IN BUHM;SONG, BYUNG CHANG;KIM, DONG IL |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|