发明名称 Thermal evaporation sources for wide-area deposition
摘要 <p>A thermal evaporation source includes: a crucible configured to contain a volume of evaporant and a vapor space above the evaporant; a manifold body having within it a hollow expansion chamber that is flowably connected to the vapor space via one or more restriction orifices; one or more effusion nozzles flowably connected to the expansion chamber and exiting an outer surface of the thermal evaporation source, the nozzle(s) oriented to direct an evaporant vapor flow out of the source vertically downward, in one or more horizontal directions, or in one or more directions intermediate between horizontal and vertically downward; and a heater capable of heating some or all of the thermal evaporation source to a temperature sufficient to produce the one or more evaporant vapor flows when a vacuum is applied to the thermal evaporation source.</p>
申请公布号 AU2008310584(A1) 申请公布日期 2009.04.16
申请号 AU20080310584 申请日期 2008.10.13
申请人 UNIVERSITY OF DELAWARE 发明人 GREGORY M. HANKET;ROBERT W. BIRKMIRE
分类号 C23C14/24 主分类号 C23C14/24
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