发明名称 Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure
摘要 A semiconductor device includes, a metal wiring, which functions as an inductor or transformer, formed on a first portion of a semiconductor substrate, a plurality of first dummy layers formed in a first density on the first portion of the semiconductor substrate, a plurality of second dummy layers formed in a second density on a second portion of the semiconductor substrate, the second portion surrounding the first portion, and a plurality of third dummy layers formed in a third density higher than the first and second densities on a third portion of the semiconductor substrate, the third portion surrounding the second portion.
申请公布号 US2009096061(A1) 申请公布日期 2009.04.16
申请号 US20080285362 申请日期 2008.10.02
申请人 NEC ELECTRONICS CORPORATION 发明人 UCHIDA SHINICHI
分类号 H01L29/86 主分类号 H01L29/86
代理机构 代理人
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