发明名称 LOOP HEAT PIPE AND ELECTRONIC EQUIPMENT
摘要 A loop heat pipe includes a vessel having a flow path formed in a looped shape and a working fluid sealed in the vessel, and the vessel includes a first wick provided at least in a opposing area in an evaporation part and a second wick adjacent to the first wick 61 from the side of a liquid return pipe. The vessel has a first wall facing a heat generating component and a second wall opposed to the first wall. The first wick has a first portion provided in the first wall and a second portion provided in the second wall with space from the first portion. The second wick is provided to cover the entire cross-section of the flow path between the first wall and the second wall.
申请公布号 US2009097206(A1) 申请公布日期 2009.04.16
申请号 US20080211421 申请日期 2008.09.16
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 TOMIOKA KENTARO
分类号 H05K7/20;F28D15/00 主分类号 H05K7/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利