发明名称 MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having a high quality terminal part formed. <P>SOLUTION: The multilayer printed wiring board 1 includes a flexible part 2 which is soft and can be bent for use, a rigid part 3 formed in connection with the flexible part 2 and more rigid than the flexible part 2, and the terminal part 4 formed at an end of the flexible part 2 in connection with the part 2. The rigid part 3 contains an insulative rigid layer 6. The terminal part 4 contains an insulative layer 8 made of the same material as that of the rigid layer 6, and also has a conductor layer 9 formed in a terminal pattern to serve as a connection terminal on the surface of the insulative layer 8. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009081342(A) 申请公布日期 2009.04.16
申请号 JP20070250675 申请日期 2007.09.27
申请人 SHARP CORP 发明人 UENO YUKIHIRO
分类号 H05K3/46 主分类号 H05K3/46
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