| 摘要 |
A stacked semiconductor package includes a semiconductor chip module including at least two semiconductor chips with a semiconductor chip body having an upper surface, a lower surface, side surfaces coupling the upper surface and the lower surface, and a circuit part. The semiconductor chips include pads coupled to the circuit part and disposed at an edge of the upper surface. A recess parts are concavely formed in the side surfaces corresponding to each pad. Conductive connection patterns cover the recess parts, and each conductive connection pattern is electrically connected to a corresponding bonding pad. The semiconductor chip module is disposed on a substrate, and the contact pads of the semiconductor substrate are electrically connected to the conductive connection patterns. The stacked semiconductor package provides an improved structure that can contain a plurality of stacked semiconductor chips with no reduction in data storage capacity.
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