| 发明名称 |
WIRING BOARD, SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THEM |
| 摘要 |
There are provided steps of providing a dielectric layer and a wiring layer on a surface of a support to form an intermediate body, removing the support from the intermediate body to obtain a wiring board, and carrying out a roughening treatment over a surface of the support before the intermediate body forming step.
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| 申请公布号 |
US2009095514(A1) |
申请公布日期 |
2009.04.16 |
| 申请号 |
US20080244232 |
申请日期 |
2008.10.02 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KANEKO KENTARO |
| 分类号 |
H05K1/00;H05K1/11;H05K1/16;H05K3/36 |
主分类号 |
H05K1/00 |
| 代理机构 |
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