发明名称 ION ACCELERATION COLUMN CONNECTION MECHANISM WITH INTEGRATED SHIELDING ELECTRODE AND RELATED METHODS
摘要 Ion accelerating devices including connection mechanisms with integrated shielding electrode and related methods are disclosed. According to an embodiment, an ion accelerating device of an ion implantation system comprises: a first element (102); a first connection system (120) within the first element, the first connection system including a first connector (124) and a first encapsulated shielding electrode (128) around the first connector and a second connection system (122) within a second element (104) other than the first element, the second connection system being coupled to the first connector; wherein the first encapsulated shielding electrode includes a first shielding portion (132) adjacent to a first interface surface (134) of the first element where the second connection system interfaces with the first element, in a cross-sectional view, the first shielding portion being substantially U-shaped.
申请公布号 WO2008121547(A3) 申请公布日期 2009.04.16
申请号 WO2008US57317 申请日期 2008.03.18
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.;TEKLETSADIK, KASEGN, D. 发明人 TEKLETSADIK, KASEGN, D.
分类号 H01J37/24;H01B17/42;H01J5/46;H01J37/317;H01R13/53 主分类号 H01J37/24
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