发明名称 |
ION ACCELERATION COLUMN CONNECTION MECHANISM WITH INTEGRATED SHIELDING ELECTRODE AND RELATED METHODS |
摘要 |
Ion accelerating devices including connection mechanisms with integrated shielding electrode and related methods are disclosed. According to an embodiment, an ion accelerating device of an ion implantation system comprises: a first element (102); a first connection system (120) within the first element, the first connection system including a first connector (124) and a first encapsulated shielding electrode (128) around the first connector and a second connection system (122) within a second element (104) other than the first element, the second connection system being coupled to the first connector; wherein the first encapsulated shielding electrode includes a first shielding portion (132) adjacent to a first interface surface (134) of the first element where the second connection system interfaces with the first element, in a cross-sectional view, the first shielding portion being substantially U-shaped. |
申请公布号 |
WO2008121547(A3) |
申请公布日期 |
2009.04.16 |
申请号 |
WO2008US57317 |
申请日期 |
2008.03.18 |
申请人 |
VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.;TEKLETSADIK, KASEGN, D. |
发明人 |
TEKLETSADIK, KASEGN, D. |
分类号 |
H01J37/24;H01B17/42;H01J5/46;H01J37/317;H01R13/53 |
主分类号 |
H01J37/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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