SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
摘要
<p>A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.</p>
申请公布号
WO2009049188(A1)
申请公布日期
2009.04.16
申请号
WO2008US79552
申请日期
2008.10.10
申请人
VISHAY GENERAL SEMICONDUCTOR, LLC;CHOU, TA-TE;TIAN, YONG-QI;LI, XIAN