| 摘要 |
<p>This invention provides an electrical connection body, which, when a metallic ultrafine particle dispersion liquid is filled into a through-hole provided in a substrate to provide wiring between substrates, the metallic ultrafine particle dispersion liquid can be filled into the through-hole even when the length in the direction of the height of the through-hole is larger than a small through-hole diameter of a few micrometers, whereby the disconnection within the through-hole can be prevented, and a method for forming an electrical connection body and a cartridge. Liquid droplets (24) are ejected through a nozzle (12) having a diameter of not more than about 5 µm, preferably not more than about 1 µm, in a liquid droplet ejection apparatus (10) toward a substrate (22) and are deposited onto the substrate (22). A plurality of the liquid droplets (24) are deposited to form a liquid droplet deposit. In this case, the following requirement is satisfied: Rm1 : Rm2 = 2 : 1 to 1 : 1 wherein Rm1 represents the diameter of a solidification product of a growth origin liquid droplet layer (34b) on a first liquid droplet (34a); and Rm2 represents the maximum diameter of a liquid droplet (34d) of the uppermost layer in the liquid droplet deposit formed by depositing a plurality of liquid droplets after the impact.</p> |
